HAFIZH MUBARAK, MUHAMMAD (2024) STUDI RECOVERY NIKEL DAN TEMBAGA DARI LIMBAH ELECTROPLATING MENGGUNAKAN ETCHING WAFER SILIKON DENGAN METODE LEACHING. S1 thesis, Fakultas Teknik Universitas Sultan Ageng Tirtayasa.
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Abstract
Global demand for metals is rapidly increasing as a consequence of the growing population and industrial infrastructure. Industrial processes such as electroplating and semiconductor manufacturing are major contributors to metal contamination in the environment. Waste from the electroplating process generally contains Zn, Ni, Cu, and Cr. This content varies based on the type of coating used. Each year, about 1.3 million tons are produced, and the European Union records the production of electroplating waste at approximately 150,000 tons of electroplating waste based on data from the US Environmental Protection Agency (EPA) in 2018. The negative impacts of this waste include environmental pollution and human health risks. This research focuses on the extraction of copper and nickel from electroplating waste using waste acid from the silicon wafer etching process. The selection of copper and nickel is based on their content in the waste (3.8% and 11.69% respectively) and their high market value. The cementation process and hydroxide precipitation are used after extraction, resulting in the best extraction rate of 91.61% for copper and 63.15% for nickel under optimal conditions: temperature 35°C, acid concentration 30%, solid-liquid ratio 10%, and rotation speed 100 rpm. These results show significant potential for the economic recovery of valuable metals from industrial waste, while reducing the environmental and health impacts of the waste.
| Item Type: | Thesis (S1) | |||||||||
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| Additional Information: | Permintaan global terhadap logam meningkat dengan cepat sebagai konsekuensi dari peningkatan jumlah penduduk dan infrastruktur industri. P roses industri seperti electroplating dan pembuatan semikonduktor menjadi salah satu penyumbang utama kontaminasi logam di lingkungan. Limbah dari proses electroplating umumnya mengandung Zn, Ni, Cu, dan Cr Kandungan ini bervariasi berdasarkan jenis pelapisan yang digunakan S etiap tahun dihasilkan sekitar 1,3 juta ton dan Uni Eropa mencatat produksi limbah electroplating sebesar kurang lebih 150 000 ton limbah electroplating berdasarkan data US Environmental Protection Agency (EPA) tahun 2018 . Dampak negatif dari limbah ini mencakup pencemaran lingkungan dan risiko kesehatan manusia. Penelitian ini berfokus pada ekstraksi tembaga dan nikel dari limbah electroplating menggunakan asam limbah dari proses etching wafer silikon. Pemilihan tembaga dan nikel didasarkan pada kandungan mereka dalam limbah (3,8% dan 11,69% masing masing) dan nilai pasar mereka yang tinggi. Proses cementation dan pengendapan hidroksida digunakan setelah ekstraksi, menghasilkan tingkat ekstraksi terbaik se besar 9 1,61 % untuk tembaga dan 63,15% untuk nikel pada kondisi optimal: temperatur 35°C, konsentrasi asam 30%, rasio padat kondisi optimal: temperatur 35°C, konsentrasi asam 30%, rasio padat--cair 10%, cair 10%, dan kecepatan putar 100 rpm. Hasil ini menunjukkan potensi signifikan untuk dan kecepatan putar 100 rpm. Hasil ini menunjukkan potensi signifikan untuk pemulihan ekonomis logam berharga dari limbah industri, sekaligus mengurangi pemulihan ekonomis logam berharga dari limbah industri, sekaligus mengurangi dampak lingkungan dan kesehatan dari limbah tersebutdampak lingkungan dan kesehatan dari limbah tersebut. | |||||||||
| Subjects: | T Technology > TN Mining engineering. Metallurgy | |||||||||
| Divisions: | 03-Fakultas Teknik 03-Fakultas Teknik > 27201-Jurusan Teknik Metalurgi |
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| Depositing User: | Mr Muhammad Hafizh Mubarak | |||||||||
| Date Deposited: | 21 Feb 2024 14:07 | |||||||||
| Last Modified: | 21 Feb 2024 14:07 | |||||||||
| URI: | http://eprints.untirta.ac.id/id/eprint/32905 |
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