RIFAI SAMBILAN, KHOIRUR (2023) STUDI PENDAHULUAN KARAKTERISTIK CASING SMARTPHONE PEREDAM RADIASI MELALUI TEKNIK ACCUMULATIVE ROLL BONDING MENGGUNAKAN VARIASI LOGAM Pb, Cu dan Al. S1 thesis, UNIVERSITAS SULTAN AGENG TIRTAYASA.
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Abstract
Smartphone as a medium of communication and information triggers humans to use it every day, it raises a new problem viz dependence or addiction in terms of its use. Use redundant smartphones will boomerang as well as a lot of problems will be caused especially related to human health one of them Is a brain disorder caused by exposure to radiation. Radiation smartphone which is a side effect of its use must be minimized such as modifying or engineering the basic ingredients of the smartphone so that The emitted radiation can be either attenuated or absorbed. In this research has An experiment was carried out to manufacture smartphone radiation absorbing materials. this process carried out on a laboratory scale, by cutting lead samples aluminum and copper with a size of 60 x 140 mm and 50 x130 mm for 3 and 4 layers. Materials 3 and 4 layers are cutting materials samples that are stacked horizontally with a total of 3 and 4 layers before in rolling process. After that, proceed with the accumulative roll process bonding to reduce sample size and produce smaller grain sizes smooth and uniform. The results of the research show that the aluminum material is stacked as many as 3 and 4 layers can reduce radiation up to 67.65% and 89.63%. Then for copper which is stacked as much as 3 and 4 layers, namely 81.50% and 86.76% as well as for lead stacked in 3 and 4 layers namely 91.70% and 96.32%. For the results of hardness testing with the method Vickers aluminum material layers 3 and 4 show values of 48 and 49 HVN. Then, for copper that is stacked as much as 3 and 4 layers shows values 77 and 87 HVN and for lead 3 and 4 layers show values 5 and 6 HVN. The results of the tensile test showed that the ultimate tensile strength value reached 80.497 MPa and 87.617 MPa for aluminum layers 3 and 4, for copper 3 and 4 layers as well as 211.35 MPa and 172.25 MPa as well as for 3 and 4 layers lead namely 7.680 MPa and 9.868 MPa. 4 ply lead material is more compatible for product design of electromagnetic radiation absorbing material.
| Item Type: | Thesis (S1) | |||||||||
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| Additional Information: | Smartphone sebagai media komunikasi dan informasi memicu manusia untuk menggunakannya setiap hari, hal tersebut menimbulkan masalah baru yaitu ketergantungan atau kecanduan dalam hal penggunaannya. Penggunaan smartphone yang berlebihan akan menjadi boomerang serta banyak masalah yang akan ditimbulkan terutama berhubungan dengan kesehatan manusia salah satunya adalah gangguan otak yang diakibatkan oleh paparan sinar radiasi. Radiasi smartphone yang menjadi efek samping dari penggunaanya harus diminimalisir seperti memodifikasi atau merekayasa bahan dasar smartphone tersebut supaya sinar radiasi yang dipancar dapat diredam atau diserap. Pada penelitian ini telah dilakukan percobaan pembuatan material peredam radiasi smartphone. Proses ini dilakukan dengan skala laboratorium, dengan cara pemotongan sampel timbal alumunium dan tembaga dengan ukuran 60 x 140 mm dan 50 x130 mm untuk 3 dan 4 lapis. Material 3 dan 4 lapisan merupakan material hasil pemotongan sampel yang ditumpuk secara horizontal dengan jumlah 3 dan 4 lapis sebelum di proses pengerolan. Setelah itu, dilanjutkan dengan proses Accumulative roll bonding untuk mereduksi ukuran sampel serta menghasilkan ukuran butir yang halus dan seragam. Hasil penelitian menunjukan material aluminium yang ditumpuk sebanyak 3 dan 4 lapis mampu meredam radiasi hingga 67,65% dan 89,63%. Kemudian untuk tembaga yang ditumpuk sebanyak 3 dan 4 lapis yaitu 81,50 % dan 86,76% serta untuk timbal yang ditumpuk sebanyak 3 dan 4 lapis yaitu 91,70 % dan 96,32%. Untuk hasil pengujian kekerasan dengan metode Vickers material alumunium lapis 3 dan 4 menunjukan nilai 48 dan 49 HVN. Kemudian, untuk tembaga yang ditumpuk sebanyak 3 dan 4 lapis menunjukan nilai 77 dan 87 HVN dan untuk timbal 3 dan 4 lapis menunjukan nilai 5 dan 6 HVN. Hasil pengujian tarik menunjukan nilai ultimate tensile strength mencapai 80,497 MPa dan 87,617 MPa untuk alumunium lapis 3 dan 4, untuk tembaga 3 dan 4 lapis serta 211,35 MPa dan 172,25 MPa serta untuk timbal 3 dan 4 lapis yaitu 7,680 MPa dan 9,868 MPa. Material timbal 4 lapis lebih kompatibel untuk desain produk material peredam radiasi elektromagnetik. | |||||||||
| Uncontrolled Keywords: | Smartphone, Radiasi, Alumunium,Timbal, Tembaga, Accumuative Roll Bonding. | |||||||||
| Subjects: | T Technology > TN Mining engineering. Metallurgy | |||||||||
| Divisions: | 03-Fakultas Teknik > 27201-Jurusan Teknik Metalurgi 03-Fakultas Teknik |
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| Depositing User: | mr Khoirul Rifai sambilan | |||||||||
| Date Deposited: | 15 Jun 2023 14:53 | |||||||||
| Last Modified: | 05 Jul 2023 16:43 | |||||||||
| URI: | http://eprints.untirta.ac.id/id/eprint/25470 |
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